We are pleased to announce that our employees Bennet Jarmer and Leon Smits will be attending this year’s Pack Expo in Chicago. Pack Expo, one of the world’s largest trade shows for packaging technologies, is the perfect opportunity to discover the latest trends and innovations in the industry.

Bennet and Leon will be available during the expo to talk to you about Roundliner’s wide range of packaging options. Whether you are looking for customised solutions for your packaging requirements or to learn more about our high number of possibilities, take the opportunity to talk to them in person!

Make an appointment now and let’s develop your customised packaging solutions together. We look forward to meeting you in Chicago!

See you soon at Pack Expo!

Roundliner GmbH
Werner-von-Siemens-Str. 19
D-76694 Forst

Phone: +49 7251 9779 11
Mail: info@roundliner.de

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